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WAKeMeUP - Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

Begin
End
Agency
FG
Identification Code
8A18001
Project Focus
aplikační
Project Type (EU)
EU
Publications ÚTIA
Web
Abstract
The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains. The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip. The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption. In the WAKeMeUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

Grant Agreement number: 783176

Call: H2020-ECSEL-2017-1-IA-two-stage

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